CIA PRINTED CIRCUIT BOARDS LTD
Our focus and expertise in the PCB Industry boosts a long trusting history and excellent Quality and Delivery service track record in the supply of all types of Printed Circuit Boards from Simple to Complex Circuits. From Fast Turn, Prototypes, Small Quantity to Large batch production we can fulfil the majority of any PCB requirement requested of us. From design to Volume manufacturing, we aim to be your number one strategic PCB partner of choice.
PCB SERVICES
PCB/CAD Design
From your schematic drawing we offer a full CAD/CAM PCB design services from pcb design experts. Gerber files and mechanical drawings ready to manufacture.
PCB Design for Manufacture Analysis
PCB Design assistance and design for manufacture analysis at the quotation stage. Front end engineering to achieve the best utilization of materials and the best options to manufacture cost effectively.
PCB Prototype and Quick Turn Production
As a support for R&D in Europe and America we provide a PCB Prototype and QuickTurn production service for all PCB technologies locally.
PCB Mass Prodiction
New Product introduction / Manufactruing instructions Verification / Fist Article, Samples approval for all Low, Medium & Volume production. for all pcb technologies. Order placement and progress chasing to ensure an on time delivery.
PCB QC, QA and Lab Analysis
The PCB production process is controlled by our QA managers and quality inspectors. In Europe and USA we also have PCB Laboratory services for PCB Failure Analysis and any defect verification.
Logistics
Our logistics solutions meet our customer needs, from safety buffer stocks, Consignment Stock Management, JIT to Kan Ban. Our principal logistics partner is DHL Danzas for air and sea freight consolidation.
PCB PRODUCTS
1L SINGLE SIDED
| Material | CEM1, CEM3 & FR4 |
| Finish | OSP, ENTEIK, HAL Pb Free, NiAu & Chemical Sn |
| Techonology | Silver, copper amd carbon ink links. Punching |
ALUMINUM
| Material | ALUMINUM BASE UPTO 4mm Thickness |
| Finish | OSP, ENTEK, HAL Pb Free, NiAu & Chemical Sn |
| Techonology | Single sided, Routing, Laser Cutting & Punching |
2L DOUBLE SIDED
| Material | CEM1 – STH) CEM3 & FR4 - PTH |
| Finish | OSP, ENTEK, HAL Pb Free, NiAu ENIG & Chemical Sn |
| Techonology | Silver, Carbon and Copper Plated Through Holes |
MULTI LAYERS
| Material | FR4, FR4 HIGH TG, HIGH FREQUENCY |
| Finish | OSP, HAL Pb Free, NiAu, Sn, ENIG & Chemical Sn |
| Techonology | Fineli, Thin core, Controlled impedance, Embedded copper coins, Heavy cooper and laser drill hdi. |
FLEX & FLEXRIGID
| Material | Mylar flex, Kapton PI, PI + FR4 |
| Finish | HAL Pb Free, NiAu ENIG & Chemical Sn |
| Techonology | Multilayer flex rigids |
SPECIAL PCBS
| Material | ROGERS, ARLON, PTFE, RT DUROIDS |
| Finish | OSP, ENTEK, HAL Pb Free, NiAu ENIG & Chemical Sn |
| Techonology | High frequency |
PCB MANUFACTURING FACILITES
| Location | Chengdu, Sichuan Province |
|---|---|
| Plant | 40,000 sqm |
| Staff | 400 – Growth plan to 600 |
| Approval | IATF 16949, ISO14001, ISO9001, UL |
| Production Cacity | 60,000sqm/month - Growth plan in progress to 100,000 sqm |
| Products | 1 AL, 2L – 12 Layers, Low Medium to Volume |
| Location | Chengdu, Sichuan Province |
|---|---|
| Plant | 40,000sqm |
| Staff | 440 – Growth plan to 700 |
| Approval | IATF 16949, ISO14001, ISO9001, UL |
| Production Cacity | 70,000sqm/month - Growth plan in progress to 100,000 sqm |
| Products | 1 AL, 2L – 8 Layers, Medium to Volume |
| Location | Fuzhou, Jiangxi Province |
|---|---|
| Plant | 80,000 sqm |
| Staff | 800 - Growth plan in progress to 900 |
| Approval | IATF 16949, ISO14001, ISO9001, UL |
| Production Cacity | 150,000sqm per month |
| Products | 2L to 10 Layers, Medium to Volume |
| Location | Huizhou, Guandong Province |
|---|---|
| Plant | 40,000 sqm |
| Staff | 500 – Growth plan to 700 |
| Approval | IATF 16949, ISO14001, ISO9001, UL |
| Production Cacity | 120,000sqm pm grow plan to 150,000 sqm |
| Products | 2L to 10 Layers, Medium to Volume |
PCB MANUFACTURING CAPABILITES
| PCB Type | Single Sided Board / Silver Through Hole | Flex Board | Rigid-Flex Board | Double Sded Board | Multilayers |
|---|---|---|---|---|---|
| Layers | 1L - 2L | 1 ~ 6L | 2 ~ 12L | 2L | 4 Layer to 32 Layers |
| Material Types | CEM-1, FR-1 FR-2 CEM-3, FR-4, Aluminum PCB | PI, PET | PI, PET, FR-4, High TG FR-4, Halogen free FR-4, High Thermal conductive material, High Frequency Material | FR-4, High TG FR-4, Halogen free FR-4, High Thermal, High Frequency Embedded Capacitor & Resistor | FR-4, High TG FR-4, Halogen free FR-4, High Thermal, High Frequency Embedded Capacitor & Resistor |
| Min. Hole Size | 0.7mm by punching 0.3mjm by CNC | 0.2mm | 0.1 mm Laser Drill HDI to any layer | ||
| Min Track & Gap | D/F 0.1/0.1mm | 0.075/0.075mm | 0.075mm | 0.05 mm | |
| PCB Thickness | 0.5 ~ 2.0mm | ≥0.05mm | 0.25 ~ 3.0mm | 0.4 ~ 3.2mm | 0.4 ~ 3.2mm |
| HASL: 5 ~ 40um | N/A | HASL: 5 ~ 40um | Chemical Sn, ENIG | ||
| ENIG: Ni Min; 2.54um; Au 0.03 ~ 0.05um | Gold - Plate | ENIG: Ni Min; 2.54um; Au 0.0254 ~ 0.0762um | ENIG: Ni Min; 2.54um; Au 0.0254 ~ 0.0762um | ||
| OSP 0.15 ~ 0.3um | ENIG / OSP | Gold - Plate + OSP | Gold - Plate + OSP | ||
