Logo CIA
PRINTED CIRCUIT BOARDS

1L SINGLE SIDED

Material
FR2, CEM1, CEM3 & FR4
Finish
OSP, ENTEK, HAL Pb Free, NiAu
Technology
Silver, copper amd carbon ink links. Punching

1L ALUMINUM

Material
ALUMINUM BASE UPTO 4mm Thickness
Finish
OSP, ENTEK, HAL Pb Free, NiAu
Technology
Single sided, routing & Punching

2L DOUBLE SIDED

Material
CEM1 – STH) CEM3 & FR4 - PTH
Finish
OSP, ENTEK, HAL Pb Free, NiAu
Technology
Silver, Carbon and Copper Plated Through Holes

MULTI LAYERS

Material
FR4, FR4 HIGH TG, HIGH FREQUENCY
Finish
OSP, ENTEK, HAL Pb Free, NiAu, Sn, ENIG
Technology
FINELI,THIN CORE, CONTROLLED IMPEDANCE, EMBEDDED COPPER COINS, HEAVY COOPER AND LASER DRILL HDI.

FLEX & FLEXRIGID

Material
MYLAR FLEX, KAPTON PI, PI + FR4
Finish
OSP, ENTEK, HAL Pb Free, NiAu ENIG
Technology
MULTILAYER FLEX RIGIDS

SPECIAL PCBS

Material
ROGERS, ARLON, PTFE, RT DUROIDS
Finish
OSP, ENTEK, HAL Pb Free, NiAu ENIG, SN PLATED
Technology
HIGH FREQUENCY