Logo CIA
PRINTED CIRCUIT BOARDS
PCB TYPE Single Sided Board / Silver Through Hole Flex Board Rigid-Flex Board Double sided board Multilayers HDI Boards
Production Production Capability
Layers 1L - 2L 1~6L 2~12L 2L 4~18L 1+N+1(N=2~8) 3+N+3(N=2~8)
Material Types CEM-1, FR-1, FR-2, CEM-3, FR-4, ALUMINUM PCB PI, PET PI, PET,FR-4, High TG FR-4, Halogen free FR-4, High Thermal conductive material, High Frequency Material FR-4, High TG FR-4, Halogen free FR-4, High Thermal, High Frequency Embedded Capacitor & Resistor FR-4, High TG FR4, Halogen free, High Thermal, High Frequency Embedded Capacitor & Resistor FR-4, High TG FR4, Halogen free, High Thermal, High Frequency Embedded Capacitor & Resistor FR-4, High TG FR-4, Halogen free, High Thermal, High Frequency, Embedded Capacitor & Resistor
Min. Hole size 0.7mm by punching 0.2 mm 0.2 mm 0.2 mm 0.15 mm laser blind 0.1mm laser blind 0.1mm
0.3mm by CNC
Min Track & Gap D/F 0.1/0.1mm 0.075/0.075mm 0.075mm 0.075mm 0.075mm 0.075mm
PCB Thickness 0.5 - 2.0mm ≥0.05mm 0.25~3.0mm 0.4 - 3.2mm 0.4 - 3.2mm 0.4 - 3.2mm 0.4 - 3.2mm
PCB Thickness HASL: 5~40um N/A HASL: 5~40um HASL: 5~40um
ENIG: Ni Min;2.54um; Au 0.03~0.05um) Gold – plate ENIG Ni Min;2.54um & Au :0.0254~0.0762um
OSP 0.15~0.3um ENIG / OSP : Gold - plate+ OSP